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staff photo Gerard E. Henein

Gerard E. Henein, Process Engineer

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Gerard Henein is a Research Scientist in the NanoFab Operations Group in CNST. He received M.S. and Ph.D. degrees in Materials Science from Northwestern University in 1976 and 1979. Following postdoctoral research at Northwestern, he joined AT&T Bell Labs in 1980. Gerard??’s research at Bell Labs has focused on the development of fabrication processes for semiconductor lasers, opto-electronic packaging and transceiver design. Gerard acquired industrial experience leading projects and product development in several opto-electronic and nanotechnology start-up companies. Gerard joined NIST in 2005 where he led a team of six engineers and technicians to bring on line the CNST NanoFab clean room with over 30 major tools in the areas of photo-, nanoimprint- and e-beam lithography, oxidation, CVD, plasma etching, metallization, wet chemical etching and electrical and optical characterization. This team grew the user base to over 200 users in two years. He has been responsible for safety, facility operations, program visibility, resource management and facility users support. Gerard has 14 publications and 6 patents. Gerard has been awarded the President’s Silver Award from Bell Laboratories in 1999 and the Department of Commerce Silver Medal in 2006. He is currently responsible for the deposition and wire bonding areas of the CNST NanoFab.


Selected Publications:

  • Stresses Induced by TiPt Ohmic Contacts, G.E. Henein and W.R. Wagner,Journal of Applied Physics, 54, 6395 (1983).
  • Elastic Modulus in Composition Modulated Silver-Palladium and Copper-Gold Foils, G.E Henein and J.E. Hilliard,Journal of Applied Physics, 54, 728 (1983).
  • Diode-Pumped Q-Switched Yb:YAG Laser, T.Y. Fan, S. Klunk and G. Henein, Optics Letters, 18 (6), 423-425 (1993).
  • Uncooled Laser Packaging Based on Silicon Optical Bench Technology, J.V. Gates, G. Henein, J. Shmulovich, D.J. Muehlner, W.M. MacDonald and R.E. Scotti, Proceedings of SPIE, 2610, 126 (1996).
  • Hybrid Integrated Silicon Optical Bench Planar Lightguide Circuits, J.V. Gates et al. (incl. G. Henein), Proceeding of the 48th Electronic Components and Technology Conference, Seattle (1998).
  • Passive Alignment Optical Subassemblies for Military/Aerospace Fiber-Optic Transmitter/Receiver Applications, M.W. Beranek et al. (incl. G. Henein), Proceeding of the 49th Electronic Components and Technology Conference (1999).

Expertise:

  • Optoelectronic chip fabrication
  • Optoelectronic transceiver design and fabrication
  • Optoelectronic packaging
  • Thin film metallization



Online: February 2006
Last Updated: August 2008

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