NIST CNST NanoFab Equipment
Inspection

Certain commercial equipment, and software, are identified in this documentation to describe the subject adequately. Such identification does not imply recommendation or endorsement by the NIST, nor does it imply that the equipment identified is necessarily the best available for the purpose.

A laser reflection-based surface curvature and stress measurement tool.

Film stress determined by the change in wafer curvature between pre-and post-deposition of film. Curvature is measured by reflected laser beam.

• Film coating stress measurement
• Stress as a function of time or temperature
• Stress on multiple films
• Stress mapping
• Silicon wafer deformation after grinding
• Temperature range: -65 to 500 °C
• Wafer size: 75 to 200mm
• Speed: 6 seconds/wafer
• Range: 1 to 4000MPa (1E7-4E10 dy/cm2)
• Repeatability: 1MPa

Bridges gap between high power optical scope and standard SEM. Ease of use, depth of focus, auto image adjustment and speed (3 min. set-up time)

• Mag: 20-10,000x
• Accel. voltage: 15kV
• Max sample size: 70mm
• Max sample thick: 20mm
• Traverse: 15x18mm
• Measurement markers

• Direct observation of non-conductive samples
• Stereoscopic observation of surface topography
• Contrast imaging based on sample atomic number differences

High performance research grade field emission SEM for imaging

• Digital system with full function computer control
• Airlock
• Pieceparts to 150 mm wafers
• Secondary and backscattered electron detectors
• Images structures down to 10 nm in size
• Resolution: 1.5 nm at 15 keV
• Magnification: 10x to 1000kx

• Measurement and inspection of nanometer level structures
• Can accommodate substrates from small pieces to 150 mm wafers

A tool used to characterize the material surface, nanostructures generated by nanofabrication. Nanomanipulation and nanolithography. The tool can take samples up to 200mm in diameter and 12mm in thickness.

• Contact mode; Tapping mode™, Phase imaging™
• Electrostatic force microscopy
• Magnetic force microscopy
• Nanomanipulation and nanolithography

• Surface characterization for thin films
• Pattern characterization for lithography structures, magnetic media, CD/DVDs
• Biomaterials, optics and other samples
• Nanomanipulation and nanolithography using AFM tip

A tool used to study the material surface characteristics, check the surface patterns generated by nanofabrication. It can take samples up to 200mm in diameter and 12mm in thickness.

• Tapping mode; Contact mode; Phase mode
• Magnetic force microscopy
• Scanning tunneling microscopy
• Stepper-motor controlled stage
• Top view optical microscopy of scanning area

• Surface characterization for thin films
• Pattern characterization for lithography structures, magnetic media, CD/DVDs
• Biomaterials, optics and other samples

The FTA32 goniometer provides video-based contact angle and surface tension measurement. Contact angles are measured by fitting a mathematical expression to the shape of a drop and then calculating the slope of the tangent to the drop at the liquid-solid-vapor (LSV) interface line. Computer software drop shape analysis gives contact angle without operator intervention or judgement.

• Contact angle measurement
• Surface tension calculation
• Liquid drop shape analysis

This system is used to measure thin films properties (thickness and refractive index).

• Thin film characterization
• Measures thickness, optical constants on single or multi-layer stacks

This system is used to measure step heights by profilometry.

• Up to 6" wafers
• Stylus force 1-15mg
• Tip radius sizes 0.7, 2.5 and 12.5 microns

• Surface characterization of MEMS, semiconductors and other thin/thick films
• Vertical measurement range of up to 1mm