News Archive

Focused Ion Beam Now Available!

The NVision40 focused ion beam (FIB) is the latest generation of ion-beam nanofabrication system, and is an incredibly versatile addition to the NanoFab toolset. It can be used for direct patterning of materials, and the ion milling process can be observed real-time with the system7rsquo;s high-resolution SEM column. The tool features a gas-injection module for ion-beam or electron-beam induced deposition of W, Pt, SiO2 and C and also has XeF2 for beam-induced etching of materials. While the machine currently has basic lithography, including the ability to pattern from bitmaps, in the next few weeks a full-featured Raith pattern generator will be added. A nanomanipulator for TEM sample liftout will be added next month.

The FIB is available under the Coral electronic tool sign-up system. Interested users should contact Rich Kasica (x2693, Richard.Kasica@nist.gov) for information on access and training. A schedule of classes serving as an introduction to ion-beam lithography will be available in the Fall, and will include a description of currently available baseline processes as well as a discussion of pattern and process design strategies. If you wish to become a user, you can find details on the NanoFab homepage

Technical Details: The ion-beam column operates from 3 kV to 30 kV and produces a focused spot of Ga ions as small as 4 nm FWHM (at low beam currents). The electron-beam column operates from 100 V to 30 kV with a resolution of approximately 2 nm — 5nm (depending on operating conditions), and can be used to observe milling operations in real time. A range of detectors is available on the system, including an energy filtered backscatter detector that can be used to distinguish between ion-beam and electron-beam generated signals. The user interface is very similar to the one on the NanoFab SEM, so there is a minimal barrier for users wishing to transition from the SEM to the FIB.

AFM and MFM Capabilities Available

Atomic Force Microscopy and Magnetic Force Microscopy are now available. See the equipment description under Equipment Listing. Interested users should contact Lei Chen (x2908, Lei.Chen@nist.gov) for information on access and training.

E-beam Writer Now Operational!

The state-of-the-art Vistec VB300 high-voltage electron beam nanolithography system, delivered earlier this year, has now completed its final acceptance tests and is open to users. This machine is capable of high-speed, high-accuracy nanoscale patterning and adds world-class capability to the CNST NanoFab.

The VB300 is available under the Coral electronic tool sign-up system. Interested users should contact Rich Kasica (x2693, Richard.Kasica@nist.gov) for information on access and training. A schedule of classes serving as an introduction to electron-beam lithography will be available in the Fall, and will include a description of currently available baseline processes as well as a discussion of pattern and process design strategies. If you wish to become a user, you can find details on the NanoFab homepage.

Technical Details: The tool operates at 100 kV, producing a focused beam of about 4 nm FWHM. The beam step is controlled by a 50 MHz, 20 bit DAC, giving a 1.25 nm step size over a 1.31 mm field. The stage is controlled by l/1024 laser interferometers. The minimum achievable feature size is resist and process dependent, but can be as small as 5 nm — 10 nm. The pattern placement accuracy is 25 nm across the full field. The system can accept substrates from piece parts to 300 mm wafers.

Parylene Deposition System has arrived

This SCS model 2010 coater, compact and easy to use, is designed for the deposition of parylene conformal coatings. These polymer coatings are biocompatible and biostable, pinhole-free and provide moisture, chemical and dielectric barriers, as well as low coefficient of friction. They are widely used in medical devices and for electronics and automotive applications. The tool is to be installed in the clean room in the next few weeks.

Parylene is applied at room temperature. The deposition equipment controls the coating rate and ultimate thickness. Polymer deposition takes place at the molecular level: the raw material dimer is vaporized under vacuum and heated to a dimeric gas. The gas is then pyrolized to cleave the dimer to its monomeric form. In the room temperature deposition chamber, the monomer gas deposits as a transparent polymer film. The thickness of coatings can vary based on the application, but thickness can range from the hundreds of angstroms to several tens of micrometers.

Microwave Plasma Asher Now Available!

The microwave plasma asher is now on-line in bay B105. It is very effective for the following processes: photoresist stripping, surface cleaning (after storage, photolithography, wet etching or dry etching), removal of organic passivating layers and masks and resist descum.

The plasma asher is available under the Coral electronic sign-up system. Interested users should contact Lei Chen (301-975-2908, lei.chen@nist.gov) for access and training.

An instruction manual for this tool is also available, see Manuals and Forms page.

• Process chamber: Inner diameter 245 mm ID; Depth 380 mm
• Batch process up to 25 wafers
• Wafer size up to 150mm diameter
• Gases: O2, CF4, N2, Ar
• Process pressure: approx. 0.2 - 2 mbar
• Frequency: 2.45 GHz
• Power Output: 0-1000 Watt

New NanoFab Tools Coming Soon!

We will be vastly expanding our capabilities in 2008 by the addition of the following tools purchased in Fiscal Year 2007. We will announce anticipated delivery and availability dates, as well as tool description and capabilities.

• Denton Vacuum 4-gun sputter system with one magnetically enhanced gun
• Suss Microtec wafer bonder
• Parylene deposition system
• End point detection on our 790 etcher
• Photoresist spinners
• Stress measurement system
• Tabletop SEM

NanoFab Users Meeting – Dec. 13, 2007

The next NanoFab Users meeting will take place on Thursday, December 13, 2007 from 1:30 to 2:30pm in room 217/H107. Marc Cangemi will give a presentation on the baseline processes used for tool benchmarking in the NanoFab. In order to ensure the stability and reproducibility of the process tools of the NanoFab, a set of standard ("baseline") processes have been developed for most tools. These processes are run at regular intervals and a relevant parameter is measured to generate statistical process control charts. The methodology used and the baseline data currently available will be presented.

For more information contact J. Alexander Liddle, NanoFab Manager.

New NanoFab Staff Member

William "Bill" Young has joined the NanoFab group as Senior Equipment Maintenance Technician. Bill has over 20 years of experience in the maintenance, operation and acquisition of wafer Fab equipment such as PVD, CVD, furnaces, plasma etchers, gas handling systems and wet decks. He is also an expert in the test and repair of sophisticated digital, RF, electromechanical and vacuum systems down to component level. Most of this experience was acquired while at National Semiconductor Inc., and Covega Corp., where he was also Emergency Response Team coordinator and commander.

CNST NanoFab Post Process Lab Now Available

The construction of the new post process lab located directly below the NanoFab Cleanroom has been completed. The lab space is approximately 600 ft² and provides access to a solvent fume hood, optical inspection microscopes, Wafer Dicing Saw, Wire bonder and an Atomic Force Microscope.

New NanoFab Hire Started April 2007

A new member, Dr. Lei Chen, joined the NanoFab team on April 16, 2007. His main focus is the development of processes and process recipes for our users. His areas of expertise in nanofabrication are lithography, RIE, wet etching, CVD, PVD, SAM, ALD, nano-imprint lithography, self assembly and polymer formulation. Lei received his PhD in polymer science and engineering from Nanjing University in 1997. After a post-doc at Princeton University, Lei joined NanoOpto Corp. in 2001 as senior engineer. His scientific knowledge and practical hands-on process and tool experience will be a great addition to our team to better help our users in their process development.

Microwave Asher is installed.

The CNST NanoFab has purchased a Plasma Processor 300 Semi Automatic Microwave Batch Plasma Processor system from PVA Tepla Inc. This system is capable of processing up to 25 eight inch wafers per batch utilizing a 1000 Watt microwave power supply. The Plasma Processor 300 Semi Automatic is used principally in the semiconductor and electronic industry for dry Ashing removal of organic material, common applications include:

• Photoresist stripping (Ashing) after plasma metal etch and after high temperature processes including ion implant, sputter etching and RIE.
• Surface cleaning of semiconductor wafers as often employed after wet etch develop of photoresist prior to wet or plasma etching (descuming).
• Surface cleaning after extended storage.
• Removal of organic passivation layers and resist.
• Etching of Silicon, Silicon Nitride, Polyimide, and other films consistent with isotropic oxygen or fluorine chemistry plasma etching.

Critical Point Dryer is Now Available!

The new Tousimis Samdri Supercritical Point Dryer is successfully used to increase yield and uniformity of MEMS and NEMS devices. Liquid carbon dioxide is the transitional fluid used to process your delicate membranes, cantilevers and other suspended structures. This tool when used for the CO2 dry release after wet etching providing the most beneficial process for reducing Stiction and increasing yield.

New Kulicke and Soffa Model 4526 Wire Bonder Now Available!

• Wedge bonder
• Semi-automatic and manual modes
• Independent Z-axis control, separate from X and Y axis control
• Force, power and time independently adjustable on each bond
• Auto step back with motorized Y stage for precise wire length and loop formation
• Wire sizes 18-75 microns (0.0007-0.003") diameter, gold and aluminum
• Ribbon sizes up to .001"x.010" (gold)